Jamie J. Zheng, Ph.D.

Registered Patent Attorney Of Counsel

Jamie J. Zheng, Ph.D.

Office: 949.202.1900

LinkedIn Profile

PDF

  • Contact Jamie   

    Attorney Contact

    Contact form on single attorney page
    • This field is for validation purposes and should be left unchanged.

Jamie J. Zheng, Ph.D.

Registered Patent Attorney Of Counsel

With a background in physics, semiconductor devices, and semiconductor processing, modeling and simulation, Jamie’s intellectual property (IP) practice involves a range of technologies, including electronic circuits, computer architecture, computer software, human-computer interfaces, digital signal processing, integrated circuit memory, computer memory modules, semiconductor devices, and semiconductor fabrication equipment and processes.

Jamie focuses primarily on patent prosecution, patent validity and infringement investigations, freedom to operate analysis, IP strategy counseling, and patent portfolio management.

  • Education
    • J.D., Santa Clara University Law School
    • Ph.D. in physics, Stanford University
    • M.S. in physics, Wuhan University
    • B.S. in physics, Wuhan University
  • Practice Focus
    • Patent prosecution
    • Patent due diligence
    • IP litigation
    • Patent portfolio management,
    • Technology licensing and engineering
    • Technology research and development
  • Professional Admissions & Associations
    • California State Bar
    • United States Patent and Trademark Office
  • Publicatons, Speaking Engagements & Presentations
    • “Modeling of side-wall passivation and ion saturation effect on etching profiles,” Proceedings of International Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits, NUPAD V. p. 37, 1994
    • “Monte Carlo simulation of the presheath in etching plasmas,“ Proceedings of the 10th Symposium on Plasma Processing, ECS Vol.     94-20, p. 46, 1994
    • “The effect of the presheath on the ion angular distribution at the wafer surface,” J. Vac. Sci. Technol. A 13 (3), p. 859, 1995
    • “Surface movement algorithm,” SPEEDIE 3.0 Manual, Stanford University, 1996
    • “Minimizing metal etch rate pattern sensitivity in a high density plasma etcher,” AVS National Symposium, 1996
    • “Measurement of etch rate pattern sensitivity during aluminum etching,” Electrochemical Society Proceeding Vol. 96-12
    • “Performance of different etch chemistries on titanium nitride anti-refractive coating layers and related selectivity and microloading improvements for submicron geometries obtained with a high density metal etcher,” J. Vac. Sci. Technol. A 15 (3), p. 702, 1997
    • “Modeling and profile simulation of silicon and metal etching in integrated circuit manufacturing,” Stanford University Ph.D Thesis, 1997
    • “Minimizing metal etch rate pattern sensitivity in a high density plasma etcher,” Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Volume: 15 Issue: 3, 1997
    • “Modeling and simulation of feature-size-dependent etching of metal stacks,” Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2001)
  • Second Language
    • Mandarin Chinese